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CSIC TIC005- Method for preparing thin films with a chemical composition spatially structured at the micrometric or nanometric scales on a support
A Spanish research institute has patented a new method for preparing thin films, with a chemical composition on the surface that is structured at the micrometric or nanometric scales, on any kind of support. This method can pattern any type of functional compound on a polymeric thin film for a wide variety of applications. The institute is looking for industrial partners for a license agreement especially in the electronics and information storage sectors
Specification sheet:
DESCRIPTION

This patented technology describes a method for preparing thin films with different materials on a solid support, which are spatially structured at the sub-micronic or nanometric scales. This method requires initial dispersion of the material into a polymeric matrix that is patterned with a mould on a support forming protuberances of the polymeric solid dispersion that are replicas of the used mould.

The resulting polymeric film is then exposed to an organic solvent that leverages the protuberances appearing in such places at higher concentration of the initially dispersed material. In such a way, a polymeric thin film with the material patterned on its surface, which is a replica of the mould, is obtained.

INNOVATIVE ASPECTS

The main innovative aspect of this technological offer is defining a method for manufacturing patterns having a different chemical nature in thin films directly on a substrate, without having to deposit or model said but modelling and subsequent conditioning of the substrate

COMPETITIVE ADVANTAGES

The main advantage of this method compare to other conventional method of the so-called soft-lithography is that this procedure can be used with any functional compound as material to be patterned as well as any kind of polymeric material as a support

KEYWORDS

Commercial Communications;Electronics, Microelectronics;Electronic Components;Other Industrial Technologies

PATENT

Patent(s) granted

CONTACT

Javier Maira
email: j.maira@orgc.csic.es
phone: +34 915854854

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